Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are ...

Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A ...

A few bright RIT students are on their way to win thousands of dollars as finalists in a North American sustainable packaging design challenge. Their project is all about ...

Last week, the car internet was lit ablaze by a patent from Porsche that depicted a design for a W-shaped, turbocharged, ...

Preventative healthcare company Qured turned to Burgopak to design user-friendly packaging for its Tap® II blood collection ...

Technology is allowing for more intelligent package solutions. Integrating tools that will satisfy regulatory requirements ...

Setting the standard for quality and creativity in the fast-growing custom packaging market ...

The Am9080 arrived in mass production in 1975 as AMD's version of Intel's 8080 – an instruction-set-compatible implementation built on AMD's own n-channel MOS process rather ...

Abstract: Copper-filled via is a critical component of advanced electronic packaging technologies. Embedded in interposer substrate, vias provide enhanced electrical performance in 2.5-D and 3-D ...

The patent showcases a unique battery assembly that can adapt to different packaging needs, potentially paving the way for ...

In 2026, Think Tank predicts brands will start shifting toward passive refill models, where the refills are built into a ...